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Semiconductor

Semiconductor adhesive solutions BEGINOR provides the semiconductor industry with chip potting protection for power modules, heat sink and shell bonding, ceramic substrate and heat sink bonding, as well as power component sealing and bonding and other adhesive application solutions.
RELEVANT DATA


功率模胶黏剂应用解决方案


The power module is a power power electronic device, which is potted into a module according to a certain functional combination, which is widely used in power electronics. The power module has the advantages of high current density, low saturation voltage and high voltage resistance of GTR (High Power Transistor), as well as the advantages of high input impedance, high switching frequency and low drive power of MOSFET (Field Effect Transistor). Silicone gel is used for potting protection of electronic modules and electronic circuit boards with high heat dissipation requirements for high-power electronic components


【IGBT Chip Potting Protection】


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BEGEL 8708 A/B dielectric insulating silicone gel


◇ 1:1 plus molding, strong adhesion, self-healing

◇High elongation, excellent flexibility, eliminate mechanical stress

◇ Very low oil permeability after curing, excellent anti-toxicity

◇ Excellent electrical insulation at high temperature, providing protection for high voltage

◇ Excellent aging resistance and weather resistance

◇ Excellent waterproof, anti-corrosion, moisture-proof and chemical resistance

◇ Can be used for semiconductor modules, sensors, etc



【Heat sink and housing bonding】


BESIL 9446 is a one-component addition-curing silicone adhesive


◇ One-component semi-flowing, rapid heating and curing

◇ Black silicone elastomer adhesive

◇ Bonding to a large number of substrates, such as stainless steel, glass, ceramics, etc., without primer

◇ Excellent flexibility and tear resistance

◇ Additive curing system: no curing by-products

◇ Obtained FDA food certification and passed ROHS\REACH certification

◇ Maintain elasticity and stability in the temperature range of -60°C~+280°C


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GLUE GUIDE
PRODUCTAPPLICATION EXAMPLEPRODUCT CATEGORYPRODUCT TYPECURING CONDITIONAPPLICATION
BEGEL 8708IGBTSiliconeOne-componentRoom temperature curingChip potting protection
BESIL 9446IGBTSiliconeOne- componentHeat curingBonding of heat dissipation plate and housing
BESIL 9445IGBTSiliconeOne-componentHeat curingBonding of ceramic substrate and heat sink plate
BEGEL 8708ThyristorSiliconeOne-componentRoom temperature curingChip potting protection
BESIL 9446ThyristorSiliconeOne-componentHeat curingBonding of heat dissipation plate and housing
BESIL 9445ThyristorSiliconeOne-componentHeat curingBonding of ceramic substrate and heat sink plate
BEEP 6225FRThyristorEpoxyTwo-componentHeat curingTerminal potting and fixing
BEGEL 8708Silicon controlled rectifierSiliconeOne-componentRoom temperature curingChip potting protection
BESIL 9446Silicon controlled rectifierSiliconeOne-componentHeat curingBonding of heat dissipation plate and housing
BESIL 9445Silicon controlled rectifierSiliconeOne componentHeat curingBonding of ceramic substrate and heat sink plate
BEEP 6225FRSilicon controlled rectifierEpoxyTwo-componentHeat curingTerminal potting and fixing