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Encapsulant_Potting Compounds_Silicone_Polyurethane_Epoxy
BESIL 8230 (7#) A/B Low Density Silicone Encapsulant

Besil 8230(7#) A/B is a two-component low density Silicone potting adhesive, after mixing, has very good flowability, operationThe time can be adjusted according to the temperature, and the room temperature can be deep cured, which is suitable for a varie
  • Soft, low durometer

  • Low viscosity

  • Room temperature or accelerated  heat cure

  • Good thermal conductivity

  • Mix ratio 1 to 1

  • Low internal stress during thermal cycling

  • Highly flowable for filling small gaps and fast processing

  • Good heat dissipation

  • Prevents water ingress

  • Electrically insulative

  • Low total cost of ownership

  • Power Conversion Devices (Inverters, Converters, Driver)

  • Junction Boxes

  • Automotive Electronics Modules

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