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Semiconductor adhesive solutions BEGINOR provides the semiconductor industry with chip potting protection for power modules, heat sink and shell bonding, ceramic substrate and heat sink bonding, as well as power component sealing and bonding and other adhesive application solutions.

The application of adhesives in semiconductors is mainly used to fix semiconductor components, such as chips, resistors, capacitors, inductors, etc., as well as packages for fixed semiconductor components, such as patch packages, transistor packages, integrated circuit packages, etc. In addition, adhesives can also be used for the welding of semiconductor components, as well as the protection and protection of semiconductor components. According to the function of use, the main categories include the chip potting protection of the power module, the bonding between the heat dissipation plate and the shell, and the bonding between the ceramic substrate and the heat dissipation plate; And sealing bonding of power components.

BEGINOR electronic potting adhesive adopts advanced production technology, can meet the different needs of customers, and has good stability and reliability. BEGINOR company has a professional R & D team, constantly improve the product, improve the performance of the product to meet the needs of customers. The company's products have been widely used in electronic, electrical, automotive, aerospace and other industries, by the customer's praise. Baigao company is committed to providing customers with quality products and services to meet customer needs and create value for customers.