❖ Curing at 90°C for 10-20 minutes after dispensing.

❖ Exhibits high thixotropy and can be stacked to a considerable height.

❖ Storage in cold conditions at low temperatures.

❖ Suitable for bonding various types of materials.

It is mainly used for adhesion of fingerprint lock and CCD / CMOS frame of camera module. It is suitable for  the adhesion of temperature sensitive components.

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you can get it from the following ways: 

◇ Click to leave a message online; 

◇ Send an email to marketing@shbeginor.com ; 

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◇ Contact BEGINOR sales staff and distributors directly;