1. When using underfill, it is found that bubbles will be generated after the adhesive is cured, why is this and how to solve it?
Air bubbles are usually caused by water vapor, which can be caused by SMT (Electronic Circuit Surface Assembly Technology) that water vapor adheres to the PCB board (printed circuit board) after a few hours, or the adhesive does not warm up sufficiently. The common solution is to heat the circuit board to a certain temperature, let the circuit board preheat, and then use a three-axis dispenser for underfill dispensing processing; and sufficient warming of the adhesive prior to application
2. What are the main parameters that need to be paid attention to when choosing an underfill adhesive?
First of all, it is necessary to select the appropriate viscosity according to the size of the product, the size and spacing of the solder balls and the process; Secondly, it is important to pay attention to the glass transition temperature (Tg) and thermal expansion coefficient (CTE) of the underfill adhesive, which affect the quality of the product and can be repaired (i.e., it can be well removed during rework)
3. What is the main reason for the adhesive not drying and how to solve it?
In most cases, this is caused by the incompatibility of flux and adhesive, one way is to use other types of solder paste, but it is generally more difficult to achieve; Another way is to choose an underfill glue that is more compatible with this paste; Sometimes heating the board a little can cure the glue to a certain extent
【Recommended Products】
BESIL TCMP Liquid Thermally Conductive Gap Filler is a two-component fast-curing liquid thermally conductive gel gasket with a thermal conductivity of 3.5 W/mK, a material containing glass beads, a fixed assembly size, a minimum controllable thickness of 0.2mm, thixotropic low-stress applications, for advanced automotive batteries, automotive electronics, communication equipment, etc. Returnable, automatically controlled feed significantly reduces waste and enables fully automated assembly for Industry 4.0 thermal interface materials
BESIL TCMP Liquid Thermally Conductive Caulk A two-component fast-curing liquid thermal conductive gel gasket with a thermal conductivity of 3.5 W/mK, a material containing glass beads, a fixed assembly size, a minimum controllable thickness of 0.2mm, thixotropic low-stress applications, for advanced automotive batteries, automotive electronics, communication equipment, etc., it provides enhanced thermal management compared to traditional materials, it provides enhanced reliability, returnability, automatically controlled feed significantly reduces waste, can achieve fully automated assembly, and corresponds to Industry 4.0 thermal interface materials
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Which TIMs is the best choice?
Basically, each application and production will be suitable with a different type of thermally conductive materials. To receive further consultant, please contact our Glue Expert at:
Hotline: (+86) 18121160382
Email: marketing@shbeginor.com
